SCALE Group Hardware Artifacts
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ATC1 is the second testchip designed and implemented by the SCALE group.
It is fabricated using TSMC 0.18 micron techonology through MOSIS. ATC1
consists of two separate modules: an ASIC module implementing AHIP
(asynchronous host interface protocol) and a DSP kernel (RGBYCC
translation) and a chunks of custom-made huge inverter chains with
body bias control.
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ATC0 is the first testchip designed and implemented by the SCALE group.
It is fabricated using TSMC 0.18 micron techonology through MOSIS.
It has a testing infrastructure and several SRAM blocks as
devices-under-test on-chip.
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We have developed a working handheld video-over-IP application to
demonstrate the potential of reconfigurable logic in accelerating
handheld applications.
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Our tester baseboard (atb1) is a single, consistent platform for testing
all of the group's chips. It has several voltage-adjustable and
current-monitored power supplies, DRAM to store current
measurements, a adjustable PECL clock, and a Xilinx FPGA to
control everything and serve as a reconfigurable interface between
a host computer and the chip being tested.
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Under Development
- Handheld Power Tracker
- DRAM Power Measurement Board
Funding
We gratefully thank our past and present sponsors, including NSF,
DARPA, CMI, Project Oxygen, Epoch-IT, Infineon, Intel, SGI, and MOSIS
Educational Program (MEP).